LOCTITE? ABLESTIK 84-1LMISR4 provides the following product：
技術(shù)：環(huán)氧
外觀：銀
固化：熱固化
pH ：6.0
產(chǎn)品好處●導(dǎo)電●箱烤箱治療●用量極小
應(yīng)用：芯片粘接
84-1LMISR4導(dǎo)電芯片粘接粘合劑已制定用于高通量，自動化模具附加設(shè)備。84-1LMISR4粘合劑的流變學(xué)允許最小的粘合劑分配和模具停留時間，沒有尾礦或串線問題。獨特的粘接特性組合使這種材料成為半導(dǎo)體工業(yè)中應(yīng)用最廣泛的模具附著材料之一。
TYPICAL PROPERTIES OF UNCURED MATERIAL
Thixotropic Index (0.5/5 rpm)
5.6
Viscosity, Brookfield CP51, 25 °C, mPa·s (cP):
Speed 5 rpm
8,000
Work Life @ 25°C, Physical worklife by % filler, hours
18
Shelf Life @ -40°C (from date of manufacture), days
365
?
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 175°C
?
Alternate Cure Schedule
?
3 to 5 minute ramp to 175°C + 1 hour @ 175°C
?
Glass Transition Temperature, TMA penetration, °C
120
Coefficient of Thermal Expansion, TMA expansion:
Below Tg, ppm/°C
40
Above Tg, ppm/°C
150
Thermal Conductivity @ 121oC, C-matic Conductance
Tester, W/(m-K)
2.5
Tensile Modulus, DMTA :
@ -65°C
N/mm2 4,400
(psi) (640,000)
@ 25 °C
N/mm2 3,900
(psi) (570,000)
@ 150 °C
N/mm2 2,000
(psi) (290,000)
@ 250 °C
N/mm2 300
(psi) (44,000)
